LEIS provides research and development activities towards hybrid mixed signal integrated systems providing quantum level sensing capabilities while increasing the embedded intelligence.

To ensure a high degree of miniaturization with a competitive advantage to preserve intellectual rights over the primary technologies LIES is covering a full integrated circuit development life cycle from the design, characterisation, modelling, reliability, and qualification. LEIS provides a faster path and the equipment to collect high-quality on-wafer measurement data to tackle the challenging test applications and to deliver critical data for devices and integrated circuits.